1.說明
BGA氣泡小，空洞率低，印刷好，,手機，電腦主板首選,尤其是密間距元件印刷性較好。
品質：
化學成分：
該Solder Paste 使用高品質真圓球形粉末,其成分如 表-1所列： 表-1 金屬成分
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Sn%
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Ag%
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Cu%
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Pb%
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Sb%
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Bi%
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Zn%
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Fe%
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Al%
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As%
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Cd%
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余量
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3.0±0.2
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0.5±0.05
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＜0.05
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≤0.10
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≤0.05
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≤0.001
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≤0.02
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≤0.001
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≤0.03
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＜0.002
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粉末顆粒范圍:
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№
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粉末尺寸(μm)及目數
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相應代號
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①
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45~25
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(-325/500)
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C
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②
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38~20
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(-400/635)
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D
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2.2 特性：
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該Solder Paste 的特性如表-2所列：
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表-2 特性值
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項
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目
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特 性 值
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試 驗 方 法
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Flux %
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11.5 ± 0.5
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JIS Z 3197 - 8.1.2
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助焊劑含量 %
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Chlorine conten in Flux %
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0.08 ± 0.02
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電位差自動滴定
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氯素含量 %
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Copper plate Corrosion
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未發生
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JIS Z 3284 - 4
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銅板腐蝕
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Water solution resistance Ω cm
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> 5×104
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水溶液阻抗 Ω cm
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JIS Z 3197 - 8.1.1
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Insulation resistance
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Ω cm
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40℃
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> 1×10
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11
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JIS Z 3284 - 3
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絕緣阻抗 Ω cm
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90%
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Migration
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無
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JIS Z 3284 - 14
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遷移試驗
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Spreading %
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> 80
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JIS Z 3197(- 8.3.1.1
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擴散率 %(CuO板)
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Viscosity
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Pa.s
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190±30
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Malcom PCU-205: 10rpm 3min
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粘度 Pa.s
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Melting
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point ℃
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217-221
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-
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融點 ℃
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Solder ball test
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等級1~3
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JIS Z 3284 -11
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錫球試驗
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適宜印刷間距
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GMC-M305-C-885 : ≥0.4
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-
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(mm)
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GMC-M305-D-885 : ≥0.3
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Slump-in-printing
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0.2mm
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JIS Z 3284 - 7
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印刷塌陷
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Slump-in-heating
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0.3mm
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JIS Z 3284 - 8
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加熱塌陷
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Tackiness(time tacking force is
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24hr
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JIS Z 3284 - 9
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粘著性(1.2N以上保持時間)
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流動特性
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0.50~0.70
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JIS Z 3284 - 6
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Fluidity characteristic(Ti)
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3.產品特點：
3.1本產品采用敝司最新開發的助焊劑而具有優異的粘度穩定性;常溫(∠35℃)下保質期為2個
月,方便運輸及保管;
3.2本產品在高溫高濕環境下,連續使用粘度穩定性非常佳;
3.3連續印刷7天,本產品仍可保持優良的性能,減少消耗量;
3.4有效減少空洞率及錫珠;
3.5有效抑制BGA虛焊的發生.
在線咨詢 
