| ApA⣩GDM300_Hapoini |
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| ϼܕrg2021-11-03 14:58:15 | g[63 | |
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| Iģʽ | ˾ͣ؟ι˾ | |
| ИIÃx | Ҫ͑ | |
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| ϵ:oo () | ֙C:18221665509 |
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ApA⣩GDM300_Hapoini ApA⣩GDM300L The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness. With 2 head polishing stage, throughput is almost double compared with 1 polish head system. Built in edge trimming system is available as an option for thin wafer process. Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process. Less than Ra1A ultra luminance, ultra mirror surface is possible. ApGDM300AL ȫԄϵyĺĥNbBm^̣ĥ25um 2ĥ^AΣa1ĥ^ϵyăɱ ߅ϵy鱡;Aӹx pָwϵAκĥAȫxMTSVMEMSˇ坍 СRa1AɳR ˽ࣺhttp://www.hapoin.com/Wafer_Grinding/ ApA⣩GDM300PaƷ Hapoini Aĥ/Ap/A/A/Wafer Grinding GNX200B/GNX200BH/GNX200BP/GDM300B |
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