據了解，觸控芯片商在觸控壓力傳感技術的實作上扮演重要的角色，手機廠若要內置此一功能，多半會先與觸控芯片商接洽，而芯片商除提供芯片與Firmware，還會提供建議的觸控壓力傳感電極圖案，以使兩者達到的匹配效能。接著，觸控芯片商會和手機廠、傳感電極貼合廠相互協調合作，完成觸控壓力傳感功能，F階段，包括意法半導體（ST）、敦泰（FocalTech）、新思（Synaptics）、Hydis皆已具備觸控壓力傳感方案，而思立微和匯頂科技（Goodix）等其他觸控芯片業者今年也預計會加入此一市場戰局。
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